TF228-M305-D-885
对环境污染的控制已成为经济发展中的首要义题，锡铅焊料是一种高度有毒的金属合金，它作为组装辅料被广泛用于现代电子组装工业。
随着欧美RoHS指令的实施，电子产品制造商已经趋向于焊料的无铅化。
The control of environmental pollution has been considered as top priorities in economy development.Tin-lead solder is a highly poisomous metal alloy to used widely in modern modern assemble industry as assemable material .As EU RoHS directive adaptep and the electronic manufactuer has move to ward to lead-free process.
由同方公司研发的TF228系列焊锡膏为客户提供优良的可焊性与印刷型。TF228系列焊锡膏解决了无铅焊料在应用中出现的各种问题，如：储存于 运输稳定性，润湿性差以及由高温焊料导致的锡膏不耐热性。
TF228 series solder paste was developed by TongFang company,which provide excellent and printbility to meet customer’s needs.The TF228 series solves various prob lems as the implementation of lead-free solder.suceh asstorage stability,delivery stality,poorsolder wettability,and poor solder paste heat resistance caused by the high temperature solder.
产品特性：
此系列锡膏是零卤产品，残留物无色透明，优点黏度低，手动印刷不费力，活性适中，空洞低。主要应用于中高端产品，如电脑主板，电视，DVB
产品规格：Solder Specfications
焊接合金之成分Composition of solder alloy
| 组成（质量%）Composition(Mass%) | ||
| SN | AG | CU |
| 余量Balance | 3.0±0.2% | 0.5±0.1% |
焊接合金之物理性质Solder alloy physical properties
| 熔融温度Melting points(°C) | ||
| 液相线Liquidus | DSC峰值DSC peak | 固相线Solidus |
| 218.0 | 220.0 | 217.0 |
| 密度（g/cm3） Density |
拉伸强度（Mpa） Tensile Strength |
延伸率（%） Elongation |
楊氏模量（Gpa） Young’s Module |
0.2%屈服点（Mpa） 0.2%Yield Point |
维氏硬度（Hv） Vickers Hardness |
| 7.38 | 53.3 | 46 | 41.6 | 39.4 | 17.9 |
锡粉规格Solder powder specification
| 类型Type | 目数Mesh | 粒度分布PSD(um) |
| T4 | -400/+635 | 20-38 |
技术数据：
物理性质Physical properties
| 项目Ctegory | 值/结果Values/Results | 测试方法/说明Methods/Remarks |
| 外观 Appearance |
外观灰白色，圆滑膏状，无明显分层。Shall not have separarated flux,and shall be in smooth paste state | 目视 Visual inspection |
| 金属含量% Metal Loading% |
88.50 | JIS- Z- 3197 8.1.2 |
| 粘度 Viscosity Pa.S |
170±30 pa.s | JIS-Z-3284 6@ Malcom PCU-205:10 rpm 3 min 25±1°C<60% RH |
| 粘着性 Tack |
Initial:75.6 gm Takc retention @ 24 hr: 120.2 gm Tack retention @ 72 hr: 96 gm | JIS- Z- 3284 9 |
| 扩散率% Spread Test% |
＞80% | JIS-Z-3197-8.3.1.1 |
| 锡球实验 Solder Ball Test |
可接受Acceptable | JIS-Z-3284 11 |
| 坍塌测试 Slump Test |
所有间距无桥接No bridges all spcings | JIS-Z-3284 7,8 |
| 印刷寿命 Stencil Life |
＞8小时Hours | @50%RH,23°C（74°F） |
| 再印刷留置时间 A bandon Time |
30-60分钟 Minutes | @50%RH,23°C(74°F) |
化学性质Chemical properties
| 活性级别 Activity Level |
ROL0 | IPC J-STD-004 |
| 卤素含量 ppm Halide content ppm |
N.D. | JIS Z 3197 8.1.4.2.1 |
| 铜镜腐蚀 Copper Mirror |
No removal of copper film 无铜层剥离 | JIS -Z -3197 8.4.2 |
| 铜板腐蚀 Copper Corrosion | 没有腐蚀发生，NO Corrosion Occur | JIS -Z -3284 8.4.1 |
电气性能
| 表面絕緣阻抗 SIR |
Ordinary state 1×1012(Ω)or above After humidifying 1×109(Ω)or above After 100hrs.in humidity | JIS Z 3284-14 |
| 電遷移 Electromigration |
Pass,Tess Conditions:65°C，88.5% RH for 596 hrs | IPC-TM-650,2.6.14.1 |
